Equipo Embedded Fanless Extensible con procesador Intel® Core™ i7/i5/i3 de 6ª Generación

Características: 

  • 6th Gen Intel® Core™ i7/i5/i3 processors with H110/Q170 chipset
  • Dual-channel DDR4 SO-DIMM sockets support up to 32GB memory
  • Support for 2 independent displays with 1 VGA, 1 DVI and 2 DisplayPort
  • MVP-6010: 1 PCIe Gen3 x16 and 3 PCI expansion slots
  • MVP-6020: 2 PCIe Gen3 x8 and 2 PCI expansion slots
  • 3 Intel® GbE ports with teaming function
  • 2 software-programmable RS-232/422/485 + 2 RS-232 ports
  • Extremely cost-effective, high performance Fanless system • Support up to 65W CPU with fanless operation