– Up to 14 cores, 20 threads at 15W/28W/45W TDP
– Up to 64GB LPDDR5 soldered down memory at 5600 MT/s, non-ECC / IBECC
– PCIe Gen4, 4x displays / 2x USB4
– Extreme rugged operating temperature (option)
Módulo COM Express Rev. 3.1 Compact Size TYPE 6 con procesador Intel® Core™ Mobile de 13ª generación
– Up to 14 cores, 20 threads at 15W/28W/45W TDP
– Up to 64GB LPDDR5 soldered down memory at 5600 MT/s, non-ECC / IBECC
– PCIe Gen4, 4x displays / 2x USB4
– Extreme rugged operating temperature (option)